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IXD_614

14-Ampere Low-Side

Ultrafast MOSFET Drivers

Features

Description

? 14A Peak Source/Sink Drive Current

? Wide Operating Voltage Range: 4.5V to 35V

? -40°C to +125°C Extended Operating Temperature

Range

? Logic Input Withstands Negative Swing of up to 5V

? Low Propagation Delay Time

The IXDD614 / IXDI614 / IXDN614 high-speed gate

drivers are especially well suited for driving the latest

IXYS MOSFETs and IGBTs. Each output can source

and sink 14A of peak current while producing voltage

rise and fall times of less than 30ns. Internal circuitry

eliminates cross-conduction and current

? Low, 10?A Supply Current

? Low Output Impedance

"shoot-through," making the driver virtually immune to

latch up. Low propagation delay with fast rise and fall

times make the IXD_614 family ideal for

Applications

high-frequency and high-power applications.

? Efficient Power MOSFET and IGBT Switching

? Switch Mode Power Supplies

? Motor Controls

? DC to DC Converters

? Class-D Switching Amplifiers

? Pulse Transformer Driver

The IXDD614 is configured as a non-inverting driver

with an enable. The IXDN614 is configured as a

non-inverting driver, and the IXDI614 is configured as

an inverting driver.

The IXD_614 family is available in an 8-pin DIP (PI),

an 8-pin Power SOIC with an exposed metal back (SI),

a 5-pin TO-220 (CI), and a 5-pin TO-263 (YI) package.

RoHS

2002/95/EC

Pb

e₃

Ordering Information

Logic

Configuration

Packing

Method

Part Number

Package Type

Quantity

IXDD614PI

IXDD614SI

IXDD614SITR

IXDD614CI

IXDD614YI

IXDI614PI

8-Pin DIP

8-Pin Power SOIC with Exposed Metal Back

5-Pin TO-220

Tube

50

100

2000

50

IN

OUT

Tape & Reel

Tube

EN

5-Pin TO-263

Tube

50

8-Pin DIP

Tube

50

IXDI614SI

8-Pin Power SOIC with Exposed Metal Back

5-Pin TO-220

Tube

100

2000

50

IN

OUT

IXDI614SITR

IXDI614CI

Tape & Reel

Tube

IXDI614YI

5-Pin TO-263

Tube

50

IXDN614PI

IXDN614SI

IXDN614SITR

IXDN614CI

IXDN614YI

8-Pin DIP

Tube

50

8-Pin Power SOIC with Exposed Metal Back

5-Pin TO-220

Tube

100

2000

50

IN

OUT

Tape & Reel

Tube

5-Pin TO-263

Tube

50

DS-IXD_614-R02

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1

IXD_614

1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.5 Electrical Characteristics: T = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

A

1.6 Electrical Characteristics: T = - 40°C to +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

A

1.7 Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2. Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3.1 IXDD614 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3.2 IXDI614 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3.3 IXDN614 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

5.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

5.4 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

5.4.1 SI (8-Pin Power SOIC with Exposed Metal Back). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

5.4.2 SI Package Tape & Reel Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

5.4.3 YI (5-Pin TO-263) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

5.4.4 CI (5-Pin TO-220) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

5.4.5 PI (8-Pin DIP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

2

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R02

IXD_614

1 Specifications

1.1 Pin Configurations

1.2 Pin Definitions

IXDD614 PI / SI

IXDD614 CI / YI

Pin Name

Description

Logic Input

V_CC

OUT

GND

IN

1

2

3

4

5

V_CC

IN

V_CC

1

2

3

4

8

7

6

5

IN

OUT

GND

Output Enable - Drive pin low to disable output,

and force output to a high impedance state

EN

GND

EN

Output - Sources or sinks current to turn-on or

turn-off a discrete MOSFET or IGBT

OUT

IXDI614 PI / SI

IXDI614 CI / YI

Inverted Output - Sources or sinks current to

turn-on or turn-off a discrete MOSFET or IGBT

V_CC

OUT

GND

IN

1

2

3

4

5

V_CC

IN

V_CC

1

2

3

4

8

7

6

5

OUT

GND

V

Supply Voltage - Provides power to the device

CC

NC

Ground - Common ground reference for the

device

GND

NC

GND

NC

Not connected

IXDN614 PI / SI

IXDN614 CI / YI

Note: Clare recommends that the exposed metal pad

on the back of the “SI” and the “D2” packages be

connected to GND. The pad is not suitable for carrying

current.

V_CC

OUT

GND

IN

1

2

3

4

5

V_CC

IN

V_CC

1

8

7

6

5

OUT

GND

2

3

4

NC

GND

NC

1.3 Absolute Maximum Ratings

Parameter

Symbol

Minimum

Maximum

Units

V

Supply Voltage

Input Voltage

-0.3

-5

40

V

CC

V

, V

IN EN

V_CC+0.3

I

Output Current

Junction Temperature

Storage Temperature

-

14

+150

A

OUT

T

°C

-55

-65

J

T

°C

STG

Unless stated otherwise, absolute maximum electrical ratings are at 25°C

Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device.

Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not

implied.

1.4 Recommended Operating Conditions

Parameter

Symbol

Minimum

Maximum

Units

V

Supply Voltage

4.5

-40

35

CC

T

Operating Temperature Range

+125

°C

A

R02

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3

IXD_614

1.5 Electrical Characteristics: T = 25°C

A

Test Conditions: 4.5V < V < 35V (unless otherwise noted).

CC

Parameter

Input Voltage, High

Conditions

Symbol

V_IH

Minimum

Typical Maximum Units

4.5V < V < 18V

CC

3.0

-

V

4.5V < V < 18V

CC

Input Voltage, Low

V_IL

-

0.8

10

0V < V < V

IN

Input Current

I_IN

CC

-

?A

EN Input Voltage, High

EN Input Voltage, Low

Output Voltage, High

Output Voltage, Low

Output Resistance, High State

Output Resistance, Low State

IXDD614 only

V_ENH

V_ENL

V_OH

V_OL

2/3V_CC

-

V

IXDD614 only

1/3V_CC

-

V_CC-0.025

-

V

-

0.025

0.8

V

=18V, I =-100mA

OUT

R_OH

R_OL

CC

0.4

0.3

?

V

=18V, I =100mA

OUT

CC

0.6

Limited by package power

dissipation

Output Current, Continuous

I_DC

-

4

A

C

=15nF, V =18V

CC

Rise Time

t_R

t_F

LOAD

-

25

18

50

31

44

200

1

35

25

70

60

70

-

=15nF, V =18V

CC

Fall Time

=15nF, V =18V

CC

On-Time Propagation Delay

Off-Time Propagation Delay

Enable to Output-High Delay Time

Disable to High Impedance State Delay Time

Enable Pull-Up Resistor

t_ONDELAY

t_OFFDELAY

t_ENOH

t_DOLD

R_EN

ns

=15nF, V =18V

CC

IXDD614 only

=18V, V =3.5V

k?

V

2

mA

CC

IN

V

=18V, V =0V

IN

Power Supply Current

I_CC

<1

10

CC

?A

V

=18V, V =V

IN CC

CC

4

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R02

IXD_614

1.6 Electrical Characteristics: T = - 40°C to +125°C

A

Test Conditions: 4.5V < V < 35V.

CC

Parameter

Input Voltage, High

Conditions

Symbol

V_IH

Minimum

Maximum

Units

4.5V < V < 18V

CC

3.3

-

0.65

10

V

4.5V < V < 18V

CC

Input Voltage, Low

V_IL

0V < V < V

IN

Input Current

I_IN

CC

-

?A

Output Voltage, High

Output Voltage, Low

-

V_OH

V_OL

R_OH

R_OL

V_CC-0.025

-

V

-

0.025

1.5

1.2

V

=18V, I =-100mA

OUT

Output Resistance, High State

Output Resistance, Low State

CC

?

V

=18V, I =100mA

OUT

CC

Limited by package power

dissipation

Output Current, Continuous

I_DC

-

1

A

C

=15nF, V =18V

CC

Rise Time

t_R

t_F

LOAD

-

50

40

90

75

85

3

=15nF, V =18V

CC

Fall Time

=15nF, V =18V

CC

On-Time Propagation Delay

Off-Time Propagation Delay

Enable to Output-High Delay Time

Disable to High Impedance State Delay Time

t_ONDELAY

t_OFFDELAY

t_ENOH

t_DOLD

ns

=15nF, V =18V

CC

IXDD614 only

=18V, V =3.5V

V

mA

CC

IN

V

=18V, V =0V

IN

Power Supply Current

I_CC

150

CC

?A

V

=18V, V =V

IN CC

CC

1.7 Thermal Characteristics

Package

Parameter

Symbol

Rating

Units

CI (5-Pin TO-220)

PI (8-Pin DIP)

36

125

85

46

3

?

Thermal Resistance, Junction-to-Ambient

Thermal Resistance, Junction-to-Case

°C/W

JA

SI (8-Pin Power SOIC)

YI (5-Pin TO-263)

CI (5-Pin TO-220)

?

SI (8-Pin Power SOIC)

YI (5-Pin TO-263)

10

2

°C/W

JC

R02

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5

IXD_614

2 Performance

2.1 Timing Diagrams

V_IH

V_IL

IN

V_IL

t

ONDELAY

OFFDELAY

90%

10%

OUT

10%

OUT

t

R

F

2.2 Characteristics Test Diagram

+

V_CC

IN

OUT

V_CC

0.1μF 10μF

V_CC

-

Tektronix

Current Probe

6302

EN

GND

V_IN

C_LOAD

6

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R02

IXD_614

3 Block Diagrams & Truth Tables

3.1 IXDD614

3.3 IXDN614

V_CC

IN

OUT

IN

GND

EN

GND

IN

EN

OUT

IN

OUT

0

1

x

1 or open

0

1

0

1

Z

0

1

3.2 IXDI614

V_CC

OUT

IN

GND

IN

OUT

0

1

0

R02

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7

IXD_614

4 Typical Performance Characteristics

Rise Time vs. Supply Voltage

(V_IN=0-5V, f=10kHz,T_A=25oC)

Fall Time vs. Supply Voltage

(V_IN=0V-5V, f=10kHz,T_A=25oC)

Rise & Fall Time vs.Temperature

(V_IN=0-5V, f=10kHz, C_L=3.6nF, V_CC=18V)

80

70

60

50

40

30

20

10

0

60

50

40

30

20

10

0

15

14

13

12

11

10

9

C_L=15nF

C_L=7.5nF

C_L=3.6nF

t_R

C_L=15nF

C_L=7.5nF

C_L=3.6nF

t_F

8

7

6

5

0

5

10

15

20

25

30

35

40

0

5

10

15

20

25

30

35

40

-40 -20

0

20 40 60 80 100 120 140

Temperature (oC)

Supply Voltage (V)

Rise Time vs. Load Capacitance

Fall Time vs. Load Capacitance

50

V_CC=4.5V

45

40

35

30

25

20

15

10

5

45

40

35

30

25

20

15

10

5

V_CC=8V

V_CC=12V

V_CC=18V

V_CC=25V

V

_CC=8V

V_CC=12V

V_CC=18V

V_CC=25V

V_CC=30V

V_CC=35V

V_CC=30V

V_CC=35V

2

4

6

8

10

12

14

16

2

4

6

8

10

12

14

16

Load Capacitance (nF)

Propogation Delay

vs. Junction Temperature

Propagation Delay vs. Supply Voltage

Propagation Delay vs. Input Voltage

(V_IN=0-5V, f=1kHz, C_L=15nF, V_CC=18V)

(V_IN=0-5V, f=1kHz, C_L=15nF)

(V_IN=0-5V, f=1kHz, C_L=15nF, V_CC=12V)

70

65

60

55

50

45

40

250

200

150

100

50

160

140

120

100

80

t_OFFDLY

t_ONDLY

t_OFFDLY

60

t_ONDLY

0

40

-40 -20

0

20 40 60 80 100 120 140

0

5

10

15

20

25

30

35

40

2

4

6

8

10

12

14

Temperature (oC)

Supply Voltage (V)

Input Voltage (V)

Input Threshold

vs.Temperature

(C_L=3.6nF, V_CC=18V)

Enable Threshold

vs. Supply Voltage

Input Threshold

vs. Supply Voltage

25

20

15

10

5

3.5

3.0

2.5

2.0

1.5

3.5

3.0

2.5

2.0

1.5

Min V_ENH

Min V_IH

Max V_IL

Max V_ENL

Max V_IL

0

5

10

15

20

25

30

35

40

-40 -20

0

20 40 60 80 100 120 140

0

5

10

15

20

25

30

35

40

Supply Voltage (V)

Temperature (oC)

Supply Voltage (V)

8

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R02

IXD_614

Supply Current vs. Load Capacitance

(V_CC=12V)

Supply Current vs. Load Capacitance

(V_CC=35V)

Supply Current vs. Load Capacitance

(V_CC=18V)

1000

100

10

1000

100

10

1000

100

10

f=2MHz

f=1MHz

f=500kHz

f=2MHz

f=1MHz

f=500kHz

f=2MHz

f=1MHz

f=500kHz

f=100kHz

f=50kHz

f=100kHz

f=50kHz

f=100kHz

f=50kHz

f=10kHz

f=1kHz

f=10kHz

f=1kHz

f=10kHz

f=1kHz

1

0.1

1

0.1

2

4

6

8

10

12

14

16

18

2

4

6

8

10

12

14

16

18

2

4

6

8

10

12

14

16

18

Load Capacitance (nF)

Load Capacitance (pF)

Load Capacitance (nF)

Supply Current vs. Frequency

(V_CC=18V)

Supply Current vs. Frequency

(V_CC=35V)

Supply Current vs. Load Capacitance

(V_CC=8V)

1000

100

10

1000

100

10

1000

100

10

C_L=15nF

C_L=7.5nF

C_L=3.6nF

C_L=15nF

C_L=7.5nF

C_L=3.6nF

f=2MHz

f=1MHz

f=500kHz

f=100kHz

f=50kHz

f=10kHz

f=1kHz

1

0.1

0.01

0.1

1

10

100

1000

10000

1

10

100

1000

10000

2

4

6

8

10

12

14

16

18

Frequency (kHz)

Load Capacitance (nF)

Quiescent Supply Current

vs.Temperature

Supply Current vs. Frequency

(V_CC=8V)

Supply Current vs. Frequency

(V_CC=12V)

2.0

1.5

1.0

0.5

0.0

-0.5

1000

100

10

1000

100

10

3.5V

5V

C_L=15nF

C_L=7.5nF

C_L=3.6nF

C_L=15nF

C_L=7.5nF

C_L=3.6nF

10V

0V & 18V

1

0.1

0.01

0.1

-40 -20

0

20 40 60 80 100 120 140

1

10

100

1000

10000

1

10

100

1000

10000

Temperature (oC)

Frequency (kHz)

Output Sink Current

vs. Supply Voltage

(C_L=330nF)

Output Source Current

vs. Supply Voltage

(C_L=330nF)

Dynamic Supply Current

vs.Temperature

(V_IN=0-5V, f=1kHz, C_L=5.4nF, V_CC=18V)

45

40

35

30

25

20

15

10

5

0

-5

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

-10

-15

-20

-25

-30

-35

0

5

10

15

20

25

30

35

40

0

5

10

15

20

25

30

35

40

-40 -20

0

20 40 60 80 100 120 140

Supply Voltage (V)

Temperature (oC)

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9

IXD_614

Output Source Current

vs.Temperature

Output Sink Current

vs.Temperature

(C_L=330nF, V_CC=18V)

-10

-12

-14

-16

-18

-20

-22

24

23

22

21

20

19

18

17

16

-40 -20

0

20 40 60 80 100 120 140

-40 -20

0

20 40 60 80 100 120 140

Temperature (oC)

Low-State Output Resistance @ +10mA

High-State Output Resistance @ -10mA

vs. Supply Voltage

0.7

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.6

0.5

0.4

0.3

0.2

0.1

0

5

10

15

20

25

30

35

40

0

5

10

15

20

25

30

35

40

Supply Voltage (V)

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IXD_614

5 Manufacturing Information

5.1 Moisture Sensitivity

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified

all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint

industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our

products to the maximum conditions set forth in the standard, and guarantee proper operation of our

devices when handled according to the limitations and information in that standard as well as to any limitations set

forth in the information or standards referenced below.

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced

product performance, reduction of operable life, and/or reduction of overall reliability.

This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to

the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.

Device

Moisture Sensitivity Level (MSL) Rating

IXD_614SI / IXD_614PI /IXD_614CI / IXD_614YI

MSL 1

5.2 ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard

JESD-625.

5.3 Reflow Profile

This product has a maximum body temperature and time rating as shown below. All other guidelines of

J-STD-020 must be observed.

Device

Maximum Temperature x Time

IXD_614CI / IXD_614YI

IXD_614PI

245°C for 30 seconds

250°C for 30 seconds

260°C for 30 seconds

IXD_614SI

RoHS

2002/95/EC

Pb

e₃

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IXD_614

5.4 Mechanical Dimensions

5.4.1 SI (8-Pin Power SOIC with Exposed Metal Back)

3.80

(0.150)

0.10 / 0.25

(0.004 / 0.010)

1.55

(0.061)

0.40 / 1.27

(0.016 / 0.050)

3.80 / 4.00

(0.150 / 0.157)

5.40

(0.209) (0.108)

2.75

5.80 / 6.20

(0.228 / 0.244)

PIN 1

0.25 / 0.50 x45o

(0.010 / 0.020 x45o)

0.60

(0.024)

1.27

(0.050)

0.31 / 0.51

(0.012 / 0.020)

1.27 BSC

(0.05 BSC)

0o / 8o

4.80 / 5.00

(0.190 / 0.197)

Recommended PCB Land Pattern

0.03 / 0.10

(0.001 / 0.004)

1.30 / 1.75

(0.051 / 0.069)

Dimensions

mm MIN / mm MAX

(inches MIN / inches MAX)

2.29 / 2.79

(0.090 / 0.110)

NOTES:

1. Molded package conforms to JEDEC standard configuration

MS-012 variation BA.

2. The exposed metal pad on the back of the SI package should

be connected to GND. It is not suitable for carrying

current.

3.30 / 3.81

(0.130 / 0.150)

5.4.2 SI Package Tape & Reel Information

?1.55 0.05

330.2 DIA.

(13.00 DIA.)

4.00 0.10 See Note #2

1.75 0.10

2.00 0.10

0.30 0.05

B

R0.50 TYP

Top Cover

Tape Thickness

0.102 MAX.

(0.004 MAX.)

5.50 0.10

(3.40)

B₀=5.20 0.10

12.00 0.30

A

Embossed Carrier

1.80 0.10

?1.50 (MIN)

B

8.00 0.10

K₀=2.30 0.10

SECTION B-B

A₀=6.40 0.10

(1.20)

Embossment

(4.70)

(70o)

NOTES:

1. A₀& B₀measured at 0.3mm above base of pocket.

2. 10 pitches cumulative tol. 0.2mm

3. ( ) Reference dimensions only.

SECTION A-A

4. Unless otherwise specified, all dimensions in millimeters.

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IXD_614

5.4.3 YI (5-Pin TO-263)

1.20 / 1.40

(0.047 / 0.055)

1.00 / 1.40

(0.039 / 0.055)

Recommended PCB Pattern

4.20 / 4.80

(0.165 / 0.189)

9.65 / 10.30

(0.380 / 0.406)

10.40

(0.409)

9.15

(0.360)

8.80 / 9.50

(0.346 / 0.374)

3.65

(0.144)

14.80 / 15.80

(0.583 / 0.622)

1

2 3 4 5

6.35

(0.250)

3.85

(0.152)

0.40 / 0.70

(0.016 / 0.028)

1.70 BSC

(0.067 BSC)

1.70

(0.067)

1.05

(0.041)

0.60 / 0.99

(0.024 / 0.039)

2.24 / 2.84

(0.088 / 0.112)

7.50 / 8.20

(0.295 / 0.323)

Optional

0o - 3o

6.60 / 7.20

(0.260 / 0.283)

DIMENSIONS

mm MIN / mm MAX

(inches MIN / inches / MAX)

2.10 / 2.70

(0.083 / 0.106)

6

NOTES:

1. All metal surfaces are solder-plated except trimmed area.

2. Short lead of No. 3 is optional to IXYS.

3. No. 3 lead is connected to No. 6 lead (bottom heat sink) internally.

1.20 / 1.70

(0.047 / 0.067)

5.4.4 CI (5-Pin TO-220)

1.14 / 1.40

(0.045 / 0.055)

9.91 / 10.54

(0.390 / 0.415)

4.32 / 4.83

(0.170 / 0.190)

7.823

(0.308)

12.387

(0.487)

14.73 / 15.75

(0.580 / 0.620)

11.94 / 12.95

(0.470 / 0.510)

6.299

(0.248)

8.64 / 9.40

(0.340 / 0.370)

3

1

2 3 4 5

6.502

(0.256)

7.620

(0.300)

DIMENSIONS

mm MIN / mm MAX

(inches MIN / inches / MAX)

25.27 / 26.54

(0.995 / 1.045)

12.70 / 14.73

(0.50 / 0.58)

0.38 / 0.64

(0.015 / 0.025)

2.29 / 2.92

1.70 BSC

(0.067 BSC)

0.64 / 1.02

(0.025 / 0.040)

Recommended Hole Pattern

(0.090 / 0.115)

Finished Hole Diameter = 1.45mm (0.057 in.)

NOTES:

1.This drawing will meet all dimensions requirement of

JEDEC outlines TS-001AA and 5-lead version TO-220AB.

2. Mounting hole diameter: 3.53 / 3.96 (0.139 / 0.156)

3.The metal tab is connected to pin 3 (GND).

1.70mm (0.067 in.)

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13

IXD_614

5.4.5 PI (8-Pin DIP)

8-0.900 DIA.

(8-0.035 DIA.)

2.540

(0.100)

9.02 / 10.16

(0.355 / 0.400)

0.20 / 0.38

(0.008 / 0.015)

7.50

(0.295)

1.40

(0.055)

6.10 / 6.86

(0.240 / 0.270)

7.62 BSC

(0.300 BSC)

2.540 BSC

(0.100 BSC)

7.37 / 8.26

(0.290 / 0.325)

7.62 / 10.92

(0.300 / 0.430)

PC Board Pattern

3.05 / 3.81

(0.120 / 0.150)

3.43 / 4.70

(0.135 / 0.185)

0.38 / 1.02

(0.015 / 0.040)

Dimensions

mm MIN / mm MAX

(inches MIN / inches MAX)

1.14 / 1.65

3.18 / 3.81

(0.125 / 0.150)

(0.045 / 0.065)

0.38 / 0.58

(0.015 / 0.023)

NOTE: Molded package conforms to JEDEC standard configuration

MS-001 variation BA.

For additional information please visit our website at: www.clare.com

Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and

product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale,

Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for

a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other

applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental

damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.

Specification: DS-IXD_614-R02

8/16/2011

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R02

型號(hào):	IXDN614CI
是否Rohs認(rèn)證：	符合
生命周期：	Transferred
IHS 制造商：	IXYS CORP
零件包裝代碼：	TO-220AB
包裝說(shuō)明：	TO-220AB, 5 PIN
針數(shù)：	3
Reach Compliance Code：	compliant
ECCN代碼：	EAR99
HTS代碼：	8542.39.00.01
風(fēng)險(xiǎn)等級(jí)：	7.94
高邊驅(qū)動(dòng)器：	NO
接口集成電路類(lèi)型：	BUFFER OR INVERTER BASED MOSFET DRIVER
JESD-30 代碼：	R-XSFM-T5
功能數(shù)量：	1
端子數(shù)量：	5
最高工作溫度：	125 °C
最低工作溫度：	-40 °C
輸出極性：	TRUE
封裝主體材料：	UNSPECIFIED
封裝代碼：	TO-220
封裝等效代碼：	SIP5,.1,67TB
封裝形狀：	RECTANGULAR
封裝形式：	FLANGE MOUNT
峰值回流溫度（攝氏度）：	NOT SPECIFIED
認(rèn)證狀態(tài)：	Not Qualified
最大壓擺率：	3 mA
最大供電電壓：	35 V
最小供電電壓：	4.5 V
標(biāo)稱(chēng)供電電壓：	18 V
表面貼裝：	NO
溫度等級(jí)：	AUTOMOTIVE
端子形式：	THROUGH-HOLE
端子位置：	SINGLE
處于峰值回流溫度下的最長(zhǎng)時(shí)間：	NOT SPECIFIED
斷開(kāi)時(shí)間：	0.075 µs
接通時(shí)間：	0.075 µs
Base Number Matches：	1

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